Sustainability of High Temperature Polymeric Materials for Electronic Packaging Applications

Abstract

Development of polymeric packaging materials for electronic devices have attracted discussions in many published works amid challenges in high speed electronic performance. In order to achieve hybrid integration in most power system, sustainable packaging materials with high thermal conductivity are needed to achieve this purpose. In this paper, attempts were made to analyse the existing packaging materials and the modification of electronics system using 2-D and 3-D dimensional packaging approaches. Also introduced in this work is the integration of polymer multi-functional block in electronic packaging which is aimed at reducing the density of electronic devices. It is hoped that the recommendation from this work will stimulate novel research and generate new interest in applications of sustainable materials for the electronics packaging industry.